Ceramic electrostatic chuck
US5191506A · kind A · utility
108Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 1991 |
| Grant date | Mar 2, 1993 |
| Priority date | — |
| Expiry date | May 2, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck 8 assembly includes, from top to bottom: a top multilayer ceramic insulating layer 10; an electrostatic pattern layer 12 having a conductive electrostatic pattern 16 disposed on a multilayer ceramic substrate; a multilayer ceramic support layer 20; and, a heat sink base 30 having a backside cooling channels machined therein. Layers 12, 12 and 20 are bonded together using multilayer ceramic techniques and the heatsink base 30 is brazed to the bottom of the multilayer ceramic support layer 20.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.