Hermetic package for an electronic device and method of manufacturing same
US5194196A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1989 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Oct 6, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree. C., while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity. The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via. The workpiece may be sintered in a sintering fixture having a frame and a compensating insert. The compensating insert and frame bound a sintering chamber for accommodating the workpiece. By providing a frame having a thermal expansion coefficient greater than that of the workpiece, and by providing…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.