Removal of excimer laser debris using carbon dioxide laser
US5194713A · kind A · utility
30Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1991 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Oct 17, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/108
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of fabricating a microelectronic circuit package. The circuit package has a reinforced fluorocarbon polymer dielectric. According to the disclosed process, vias or through holes are formed in the composite by a process that leaves debris. The debris in the formed vias or through holes is reflowed in order to smooth the via and through hole walls for subsequent plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.