Frank D. Egitto
88Patents
18h-index
84Co-inventors
87Inventor score
Filing activity: Oct 26, 1981 → Jun 14, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5774340A | Planar redistribution structure and printed wiring device | Emerging Cross-Sectional Technologies | 237 | Expired |
| US7301108B2 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Emerging Cross-Sectional Technologies | 95 | Expired |
| US7011531B2 | Membrane probe with anchored elements | Emerging Cross-Sectional Technologies | 94 | Expired |
| US7800916B2 | Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same | Emerging Cross-Sectional Technologies | 66 | Active |
| US5693928A | Method for producing a diffusion barrier and polymeric article having a diffusion barrier | Chemistry; Metallurgy | 61 | Expired |
| US7292055B2 | Interposer for use with test apparatus | Electricity | 56 | Expired |
| US6156484A | Gray scale etching for thin flexible interposer | Physics | 48 | Expired |
| US4376672A | Materials and methods for plasma etching of oxides and nitrides of silicon | Emerging Cross-Sectional Technologies | 46 | Expired |
| US6252012A | Method for producing a diffusion barrier and polymeric article having a diffusion barrier | Chemistry; Metallurgy | 45 | Expired |
| US4412885A | Materials and methods for plasma etching of aluminum and aluminum alloys | Chemistry; Metallurgy | 36 | Expired |
| US6074895A | Method of forming a flip chip assembly | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5194713A | Removal of excimer laser debris using carbon dioxide laser | Electricity | 30 | Expired |
| US6509546B1 | Laser excision of laminate chip carriers | Electricity | 27 | Expired |
| US7501839B2 | Interposer and test assembly for testing electronic devices | Electricity | 26 | Active |
| US5958996A | Method for producing a diffusion barrier and polymeric article having a diffusion barrier | Chemistry; Metallurgy | 23 | Expired |
| US7738249B2 | Circuitized substrate with internal cooling structure and electrical assembly utilizing same | Emerging Cross-Sectional Technologies | 23 | Active |
| US6826830B2 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5460921A | High density pattern template: materials and processes for the application of conductive pastes | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6000130A | Process for making planar redistribution structure | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6206997A | Method for bonding heat sinks to overmolds and device formed thereby | Electricity | 18 | Expired |
| US6881072B2 | Membrane probe with anchored elements | Emerging Cross-Sectional Technologies | 16 | Expired |
| US4985112A | Enhanced plasma etching | Electricity | 16 | Expired |
| US4654115A | Process for removing contaminant | Electricity | 14 | Expired |
| US5789121A | High density template: materials and processes for the application of conductive pastes | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5536579A | Design of high density structures with laser etch stop | Emerging Cross-Sectional Technologies | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.