Wafer carrier
US5195729A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 1991 |
| Grant date | Mar 23, 1993 |
| Priority date | — |
| Expiry date | May 17, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67346
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier for a semiconductor wafer or other substrate has an outer portion adapted for engagement by equipment for processing wafers. Interior to the outer portion a substantially planar supporting surface is provided. A retaining lip is provided above the plane in which the supporting surface lies by at least the height of a wafer of a selected size. The circumference of the retaining lip is of sufficient size and proper shape to permit the passage of a wafer of the selected size. The carrier is undercut under the lip, whereby a wafer of the selected size, when placed on the supporting surface, may be retained. In one embodiment, the carrier has a cylindrical shape. The top of the carrier includes a flat outer ring-like surface. The supporting surface and the circumference of the retaining lip are both circular.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.