High pin count and multi-layer wiring lead frame
US5196725A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1991 |
| Grant date | Mar 23, 1993 |
| Priority date | — |
| Expiry date | Jun 6, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high pin count and multi-layer lead frame according to the present invention which has a short pitch, high density lead pattern and at the same time, enhanced transmission characteristics for high-frequency signals includes at least one pair of conductive layers for grounding, power supply or both of them and one pair of insulating layers formed on these conductive layers, inner leads formed on the insulating layer on the top conductive layer by etching or vapor deposition in a short pitch, high density pattern, and outer leads made of metal frame. The inner leads are electrically connected to the leads for signals of the outer leads, the leads for grounding and power supply of the outer leads are connected to each of the conductive layers separately, and a plurality of holes for wire bonding the electrodes of a semiconductor element to each of the conductive layers are formed on each of the insulating layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.