Polishing pad for planarization
US5197999A · kind A · utility
103Cited by
9References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Mar 30, 1993 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1409
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad for planarization by mechanical polishing of a dielectric layer formed over features on a wafer in the manufacture of semiconductor devices has a substantially planar polishing face. The pad includes a soft matrix material and a substance for stiffening distributed in the pad so as to effect stiffening of the pad. The substance for stiffening is composed of a hard substance, which in a preferred embodiment is in the form of discrete particles distributed substantially uniformly throughout substantially all of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.