Electroless gold plating solution and method for plating gold therewith
US5198273A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 11, 1990 |
| Grant date | Mar 30, 1993 |
| Priority date | — |
| Expiry date | Sep 11, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides an electroless gold plating solution comprising essentially gold ions, a complexing agent, and a reducing agent, characterized by further containing a reduction promoter which has a function of giving electrons to an oxidant, the oxidant being produced from oxidation of the reducing agent with the gold ions being reduced, to change the oxidant to the original reducing agent. The present invention also provides a process for conducting electroless gold plating by bringing a substrate into contact with the electroless gold plating solution. The plating solution is excellent in the stability for gold plating of high deposition rate. Thus the present invention allows the electroless gold plating to be performed stably at a higher deposition rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.