Setsuo Ando
6Patents
3h-index
15Co-inventors
54Inventor score
Filing activity: Apr 20, 1988 → Jun 7, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4963974A | Electronic device plated with gold by means of an electroless gold plating solution | Emerging Cross-Sectional Technologies | 43 | Expired |
| US5202151A | Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same | Chemistry; Metallurgy | 20 | Expired |
| US5198273A | Electroless gold plating solution and method for plating gold therewith | Chemistry; Metallurgy | 10 | Expired |
| US6866765B2 | Electrolytic copper-plated R-T-B magnet and plating method thereof | Emerging Cross-Sectional Technologies | 3 | Expired |
| US10312604B2 | Crimping terminal and electric wire with crimping terminal | Performing Operations; Transporting | 0 | Active |
| US10597790B2 | Refined copper, method of producing refined copper, electric wire and method of manufacturing electric wire | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.