Method for seal molding electronic components with resin
US5200125A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 13, 1989 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | Dec 13, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/251
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronic component is molded into a resin seal by first compressing a resin tablet to increase its density by removing air contained in the tablet. The compressed or molded resin tablet is supplied into a pot (3) wherein the tablet is melted by heat. The melted resin is injected under pressure into cavities (5a, 5b) through a transfer path (9), whereby electronic components (10) set in these cavities (5a, 5b) are seal molded. This method substantially prevents air from being mixed into the melted resin and also avoids the formation of a void within and on the surface of a resin sealed molding of the electronic components (10) encapsulated in the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.