Polyimide adhesive composition including barbituric acid modifier
US5200474A · kind A · utility
7Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1990 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | Aug 22, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide adhesive composition is a reaction product of polyamic acid and bismaleimide (I) modified by barbituric acid (II) or the derivatives thereof. Once the present composition is directly coated onto copper foil, the bonding force is greatly improved as compared to compositions without (II) or (I) and (II). Therefore, the adhesive normally used in the manufacture of flexible printed circuits boards and tape automated bonding (TAB) is no longer necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.