Stacked printed circuit board device
US5200917A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1991 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | Nov 27, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/141
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a stacked integrated circuit module 20 which is interchangeable with standard printed circuit boards. Module 20 has two PCBs 22 and 24 and multiple memory ICs 26a-26d mounted on the PCBs. A board alignment support 48 is provided between PCBs 22 and 24 to support the PCBs in a spaced and substantially parallel relation and to provide electrical interfacing between the two PCBs. PCB 22 has an edge connector 44 adapted to be inserted into standard receptacle connectors provided on a mother board. According to this stacked arrangement, memory ICs 26c and 26d are addressable through connector 44, conductive paths formed on PCB 22, board alignment support 48, and conductive paths formed on PCB 24.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.