Lamination method for coating the sidewall or filling a cavity in a substrate
US5208068A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1990 |
| Grant date | May 4, 1993 |
| Priority date | — |
| Expiry date | Dec 13, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1438
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Method for pressing a material into a through-hole or blind-hole in a substrate. The material is disposed on the surface of the substrate. An environment is provided permitting the material to flow for example by heating the material to the glass transition temperature or above. Thereafter pressure is applied causing the material to flow, first coating the sidewall of the hole and on the continued application of pressure the material flows to completely fill the hole. The resulting substrate can have a substantially planar surface having holes with the periphery coated with or completely filled with the material. The material is preferably a thermoplastic polymeric material such as a polyimide and a perfluorinated polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.