Charles R. Davis
25Patents
13h-index
69Co-inventors
84Inventor score
Filing activity: Aug 28, 1987 → Aug 31, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5208068A | Lamination method for coating the sidewall or filling a cavity in a substrate | Electricity | 107 | Expired |
| US7098676B2 | Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor | Electricity | 38 | Expired |
| US5620782A | Method of fabricating a flex laminate package | Emerging Cross-Sectional Technologies | 36 | Expired |
| US5384690A | Flex laminate package for a parallel processor | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6486557B1 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Electricity | 27 | Expired |
| US5357005A | Reactive surface functionalization | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5280414A | Au-Sn transient liquid bonding in high performance laminates | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6650010B2 | Unique feature design enabling structural integrity for advanced low K semiconductor chips | Electricity | 22 | Expired |
| US5460921A | High density pattern template: materials and processes for the application of conductive pastes | Emerging Cross-Sectional Technologies | 21 | Expired |
| US4787077A | Process for optically storing information using materials having a single phase in both the crystalline state and the amorphous state | Emerging Cross-Sectional Technologies | 20 | Expired |
| US5679444A | Method for producing multi-layer circuit board and resulting article of manufacture | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5789121A | High density template: materials and processes for the application of conductive pastes | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5421507A | Au-Sn transient liquid bonding in high performance laminates | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5509196A | Method of fabricating a flex laminate package | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5536579A | Design of high density structures with laser etch stop | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5709805A | Method for producing multi-layer circuit board and resulting article of manufacture | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5206074A | Adhesives on polymide films and methods of preparing them | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6531759B2 | Alpha particle shield for integrated circuit | Electricity | 8 | Expired |
| US6815346B2 | Unique feature design enabling structural integrity for advanced low k semiconductor chips | Electricity | 8 | Expired |
| US7294565B2 | Method of fabricating a wire bond pad with Ni/Au metallization | Electricity | 8 | Expired |
| US7009280B2 | Low-k interlevel dielectric layer (ILD) | Electricity | 7 | Expired |
| US5626771A | Design of high density structures with laser etch stop | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5340451A | Process for producing a metal organic polymer combination | Electricity | 4 | Expired |
| US5872337A | Chip carrier and cable assembly reinforced at edges | Electricity | 0 | Expired |
| US11439969B2 | Accelerated cooling process for reactors | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.