Memory card with flexible conductor between substrate and metal cover
US5208732A · kind A · utility
54Cited by
19References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1991 |
| Grant date | May 4, 1993 |
| Priority date | — |
| Expiry date | May 29, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0256
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory card has a housing including an interior chamber and a top metal cover. A substrate is located in the interior chamber and carries printed circuit leads, packaged semiconductor devices connected to selected printed circuit leads, and a connector connected to selected printed circuit leads. The packaged semiconductor devices are spaced from the top metal cover and a thermal coupler is located between the top metal cover and the packaged semiconductor devices for coupling heat generated by the packaged semiconductor devices to the top metal cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.