Recessed chip capacitor wells with cleaning channels on integrated circuit packages
US5210683A · kind A · utility
8Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 22, 1991 |
| Grant date | May 11, 1993 |
| Priority date | — |
| Expiry date | Aug 22, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0306
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Wells are formed in an external surface of a semiconductor device package body. Capacitors are disposed within the wells at least partially, and preferably fully within the body. Cleaning channels are formed underneath the capacitors, for removing residual flux and/or solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.