Tom Ley
8Patents
6h-index
10Co-inventors
60Inventor score
Filing activity: Aug 22, 1991 → Jun 10, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5249098A | Semiconductor device package with solder bump electrical connections on an external surface of the package | Electricity | 21 | Expired |
| US6512675B1 | Heat sink grounded to a grounded package lid | Electricity | 21 | Expired |
| US5500555A | Multi-layer semiconductor package substrate with thermally-conductive prepeg layer | Electricity | 20 | Expired |
| US6417563B1 | Spring frame for protecting packaged electronic devices | Electricity | 8 | Expired |
| US5210683A | Recessed chip capacitor wells with cleaning channels on integrated circuit packages | Electricity | 8 | Expired |
| US6362522B1 | Cool frame for protecting packaged electronic devices | Electricity | 6 | Expired |
| US8008133B2 | Chip package with channel stiffener frame | Electricity | 4 | Active |
| US8405187B2 | Chip package with channel stiffener frame | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.