Patent · US Expired

Method for manufacturing an MOS transistor

US5212104A · kind A · utility

6Cited by
2References
14Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 9, 1992
Grant dateMay 18, 1993
Priority date
Expiry dateMar 9, 2012

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D62/314

Abstract

A method for the manufacture of an MOS transistor. A channel region is produced by selective epitaxy on a substrate (1) doped with a first conductivity type, said channel region containing a delta-shaped layer (5) doped with the first conductivity type. Source region (13) and drain region (14) are formed, in particular, by drive-out from a doped glass layer (12).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.