Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means
US5213249A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 1992 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | May 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: a. an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; b. means for measuring the instantaneous AC current and instantaneous AC supplied to said ultrasonic source; c. means for multiplying the instantaneous AC voltage and the instantaneous AC current to determine the instantaneous power supplied to said ultrasonic source; and d. monitor means coupled to said ultrasonic source and said power determining means for monitoring the instantaneous power supplied to said ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.