Method of assembling integrated circuits to a silicon board
US5214844A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1990 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | Dec 17, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly structure and process for attaching integrated circuits to multichip modules and attaching the module to a printed circuit board. An epoxy loaded with diamond dust or boron nitride is used to attach the integrated circuit to the module. The dust material increases the thermal conductance of the epoxy for improved heat dissipation without substantially increasing the capacitance of interconnect routed underneath the epoxy. Reverse wedge wire bonding is also used to electrically connect the integrated circuit to the module allowing greater chip densities on the module surface. The chip/module assembly can then be mounted on a printed circuit board and the module leads wired directly to the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.