nChip, Inc.
6Patents
0Active
6Granted
30Portfolio score
Filing activity: Dec 17, 1990 → May 24, 1996
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5397997A | Burn-in technologies for unpackaged integrated circuits | Electricity | 214 | Expired |
| US5804004A | Stacked devices for multichip modules | Emerging Cross-Sectional Technologies | 110 | Expired |
| US5541524A | Burn-in technologies for unpackaged integrated circuits | Electricity | 54 | Expired |
| US5274270A | Multichip module having SiO.sub.2 insulating layer | Electricity | 51 | Expired |
| US5134539A | Multichip module having integral decoupling capacitor | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5214844A | Method of assembling integrated circuits to a silicon board | Emerging Cross-Sectional Technologies | 9 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.