Method of mounting silicon wafers on metallic mounting surfaces

US5215244A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Juergen Buchholz · Kaufbeuren, DE
• Hans-Peter Trah · Reutlingen, DE
• Wolfgang Klucken · Gomaringen, DE

Key dates

• Filing date: Feb 24, 1992
• Grant date: Jun 1, 1993
• Expiry date: Feb 24, 2012

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12042
• WIPO field: Mechanical elements
• WIPO sector: Mechanical engineering

Abstract

A method of mounting a semiconductor wafer (10) on a metallic mounting surface, particularly during manufacture of valves with macromechanical valve bodies (20), features the steps of applying a metallization (11) to at least one major surface of the semiconductor wafer, and thereafter soldering the thus-metallized major surface, either wholly or in localized surface areas, to the metallic mounting surface.