Hans-Peter Trah
18Patents
10h-index
34Co-inventors
68Inventor score
Filing activity: Aug 22, 1991 → Jul 22, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5375979A | Thermal micropump with values formed from silicon plates | Mechanical Engineering; Lighting; Heating | 240 | Expired |
| US5216273A | Microvalve of multilayer silicon construction | Mechanical Engineering; Lighting; Heating | 66 | Expired |
| US5244154A | Perforated plate and fuel injection valve having a performated plate | Emerging Cross-Sectional Technologies | 56 | Expired |
| US5344117A | Micro-actuator | Emerging Cross-Sectional Technologies | 50 | Expired |
| US5215244A | Method of mounting silicon wafers on metallic mounting surfaces | Electricity | 41 | Expired |
| US5254209A | Method of making micromechanical components | Physics | 30 | Expired |
| US6462392B1 | Micromechanical cap structure and the respective manufacturing method | Performing Operations; Transporting | 18 | Expired |
| US6062088A | Pressure sensor | Physics | 13 | Expired |
| US5402937A | Perforated body and valve with perforated body | Mechanical Engineering; Lighting; Heating | 13 | Expired |
| US5242533A | Method of structuring a semiconductor chip | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5595940A | Method of producing micromechanical structures | Physics | 9 | Expired |
| US5282926A | Method of anisotropically etching monocrystalline, disk-shaped wafers | Physics | 8 | Expired |
| US6863438B2 | Microstructured thermosensor | Physics | 8 | Expired |
| US7321156B2 | Device for capacitive pressure measurement and method for manufacturing a capacitive pressure measuring device | Physics | 3 | Expired |
| US5261639A | Valve | Mechanical Engineering; Lighting; Heating | 2 | Expired |
| US5286341A | Process for producing micro-mechanical structures | Physics | 2 | Expired |
| US6989609B2 | Method and apparatus for supplying energy to sensors | Electricity | 1 | Expired |
| US7709933B2 | Structural element having a porous region at least regionally provided with a cover layer and its use as well as method for setting the thermal conductivity of a porous region | Chemistry; Metallurgy | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.