Method of manufacturing pn-junction device II-VI compound semiconductor
US5215929A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1991 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | Nov 29, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/812
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a pn-junction device, especially a blue light-emitting diode and a method of the manufacturing thereof. The pn-junction is formed between a superlattice region and a n-type semiconductor region, the superlattice region consisting of a plurality of stacked pairs of ZnSe semiconductor layer and acceptor-impurity-doped ZnS.sub.0.12 Se.sub.0.88 mixed crystal semiconductor layer formed on a part of a buffer layer of ZnS.sub.0.06 Se.sub.0.94 etc. which is formed on a crystalline substrate of GaAs etc., the n-type semiconductor region being formed on the part of the buffer layer, where the superlattice is not formed, and the side wall of the superlattice region contiguous to the n-type region to form pn-junction being made clean by etching, so that a pn-junction of n-type semiconductor and p-type semiconductor having high carrier-density resulted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.