Optimized integral heat pipe and electronic circuit module arrangement
US5216580A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1992 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | Jan 14, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evaporator chamber and condenser assembly is attached to the multi-chip module and wick assembly. A suitable working fluid is introduced into the vapor chamber and the vapor chamber hermetically sealed. Application of the thermal wick to the heat producing multi-chip module eliminates the thermal impedance contributed by thermal transmission media used in prior art heat pipe assemblies, permitting a doubling of heat flux from the multi-chip module to the heat pipe evaporator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.