Method and apparatus for removing bonded connections
US5216803A · kind A · utility
15Cited by
14References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Dec 11, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Removing welded outer lead bonds of TAB tape leads to contacts on a substrate. The method includes separating the electrical leads adjacent the weld bonds leaving a remnant, engaging the remnant with a shear tool, and moving the tool and bond relative to each other shearing the remnant. In some cases the tool is ultrasonically vibrated in a direction transversely to the relative movement of the tool and bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.