HTCC/LTCC substrate blanker/multi-layer collation die
US5217216A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Dec 18, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus for blanking and collating a plurality of individual pyrolyzable sheets having electrical circuit patterns formed thereon from an integral pyrolyzable sheet having the electrical circuit patterns for the individual sheets printed thereon, where the individual pyrolyzable sheets comprise layers of a hybrid module. The apparatus includes a die having substantially identically sized openings for supporting the integral printed pyrolyzable sheet, a punch assembly engageable with the die for blanking the integral printed pyrolyzable sheet into a plurality of substantially identically sized sheets having electrical circuit patterns formed thereon, and a collation structure located beneath the means for receiving the blanked sheets from the die and for stacking the blanked sheets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.