Densifying and polishing glass layers
US5217566A · kind A · utility
13Cited by
12References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Aug 26, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4644
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A glass passivation layer is deposited, densified and polished. Thereby an underlying wafer containing substantially defined devices is exposed to a temperature cycle that is sufficient for densification of the glass, and no more. Reflow and its attendant additional temperature cycle are thereby avoided, allowing for smaller, faster devices to be fabricated. Increased control over the ultimate thickness of the glass layer is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.