Wafer holding device in an exposure apparatus
US5220171A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1991 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | Nov 1, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70875
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate holding device includes a chuck having an attracting surface for holding a substrate, an inside space and an inside heat pipe structure provided in the inside space, the heat pipe structure removing generated heat by evaporation of a liquid medium; a temperature controlling block having a structure that allows flow of a temperature controlling medium therethrough, the temperature controlling block being thermally coupled to the attracting surface of the chuck through the heat pipe structure; and a stage for moving the chuck and the temperature controlling block as a unit, and for supporting the chuck through the temperature controlling block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.