Method and an apparatus for testing the assembly of a plurality of electrical components on a substrate
US5220280A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 1989 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | May 11, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2801
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In the present invention a method of testing a partially completely assembled module with integrated circuit dies mounted thereon is disclosed. The partially-completely assembled module has one or more first locations with integrated circuit dies mounted thereon and one or more second locations with integrated circuit dies to be mounted thereon and one or more electrical paths electrically connecting the first and second locations. A supplementary module with one or more electrical components assembled in the second locations and with one or more electrical components to be assembled in the first locations and with electrically identical electrical paths connecting the first and second locations as the testing module is also provided. The testing module and the supplementary module are mated together by electrically connecting the first and second locations of the testing module to the first and second locations of the supplementary module, respectively. The resultant combined module is tested as if it were a completely assembled module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.