Method and apparatus for temperature measurement using thermal expansion
US5221142A · kind A · utility
11Cited by
19References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 20, 1991 |
| Grant date | Jun 22, 1993 |
| Priority date | — |
| Expiry date | May 20, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K5/52
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for determining the temperature of an object, such as a semiconductor wafer by measuring the physical change in a dimension of the semiconductor wafer is disclosed. This physical change is then correlated to the temperature using the coefficient of thermal expansion for the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.