Plastic mold type semiconductor device
US5223740A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1991 |
| Grant date | Jun 29, 1993 |
| Priority date | — |
| Expiry date | Apr 29, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plastic mold semiconductor device comprises a semiconductor chip; a die pad which is made of a thin metallic plate for supporting the semiconductor chip; leads which surround the die pad, wires for connecting electrodes on top of the semiconductor chip and the leads; and plastic mold for sealing the entire device; the die pad being comprised of support sections separated by a fixed gap from a sub-element interconnecting member which is insulated from the semiconductor chip, and connection between the power source or signal related lead and the electrode which is on top the semiconductor chip and is located from the power source or signal related lead is connected by the sub-element interconnecting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.