Toshimitsu Ishikawa
13Patents
8h-index
15Co-inventors
65Inventor score
Filing activity: Oct 17, 1985 → Feb 15, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5616962A | Semiconductor integrated circuit devices having particular terminal geometry | Emerging Cross-Sectional Technologies | 48 | Expired |
| US4817367A | Apparatus for manufacturing gelatin capsule and method therefor | Human Necessities | 32 | Expired |
| US6402496B2 | Gelatin capsule manufacturing apparatus | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5592020A | Semiconductor device with smaller package having leads with alternating offset projections | Electricity | 23 | Expired |
| US5362354A | Apparatus for manufacturing a semiconductor device | Electricity | 14 | Expired |
| US4686079A | Fuel assembly | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5276352A | Resin sealed semiconductor device having power source by-pass connecting line | Electricity | 13 | Expired |
| US6238616A | Method of manufacturing gelatin capsule containing powder or time release pellets | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5939792A | Resin-mold type semiconductor device | Electricity | 7 | Expired |
| US5773321A | Semiconductor integrated circuit devices having particular terminal geometry and mounting method | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5223740A | Plastic mold type semiconductor device | Electricity | 5 | Expired |
| US5801433A | Semiconductor device with smaller package | Electricity | 4 | Expired |
| US6194779A | Plastic mold type semiconductor device | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.