Surface wave components with an acoustically matched damping compound

US5227219A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Heiner Bayer · Olching, DE
• Michael Rogalli · Rottenburg am Neckar, DE
• Frank Dittrich · Sinsheim, DE
• Hans Stelzl · Vaterstetten, DE

Key dates

• Filing date: Sep 5, 1989
• Grant date: Jul 13, 1993
• Expiry date: Sep 5, 2009

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31511
• WIPO field: Other consumer goods
• WIPO sector: Other fields

Abstract

An acoustically matched reaction resin compound for damping coating of surface wave components is disclosed that contains one or more epoxy resins, one or more dicarboxylic acids or polycarboxylic acids or, respectively, acidic esters of dicarboxylic acids or polycarboxylic acids, an aliphatic or hetero-aromatic amine in a proportion sufficient to catalyze the cross linking of the reaction resin compound, and a solvent. The number of amine hydrogen equivalents and acid equivalents together is less than the number of epoxy equivalents and the uniformly mixed reaction resin compound can be set to a predetermined viscosity and thixotropy required for the application. For example, the reaction resin compound can be applied onto the wafer containing the surface wave components in a silk screening process. Sharp contours can be produced that survive the curing process in an unmodified state. The damping properties of cured reaction resin structures are excellent; corrosion induced by the resin is noticeably reduced.