Inventor · Rottenburg am Neckar, DE

Michael Rogalli

16Patents

4h-index

32Co-inventors

60Inventor score

Filing activity: Sep 5, 1989 → Aug 22, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US6790737B2	Method for fabricating thin metal layers from the liquid phase	Electricity	29	Expired
US6958256B2	Process for the back-surface grinding of wafers	Electricity	8	Expired
US5917705A	Chip card	Electricity	6	Expired
US5468786A	Radiation-curable reaction resin system	Chemistry; Metallurgy	4	Expired
US9165821B2	Method for providing a self-aligned pad protection in a semiconductor device	Electricity	3	Active
US5780103A	Method for forming of a silicon oxide layer on a topography	Electricity	2	Expired
US10103123B2	Semiconductor devices and processing methods	Electricity	2	Active
US5227219A	Surface wave components with an acoustically matched damping compound	Emerging Cross-Sectional Technologies	2	Expired
US6380076B2	Dielectric filling of electrical wiring planes	Electricity	1	Expired
US12040288B2	Chip package and method of forming a chip package	Electricity	0	Active
US11424201B2	Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device	Electricity	0	Active
US11735534B2	Chip package and method of forming a chip package	Electricity	0	Active
US9385031B2	Method for providing a self-aligned pad protection in a semiconductor device	Electricity	0	Active
US9418937B2	Integrated circuit and method of forming an integrated circuit	Electricity	0	Active
US10446469B2	Semiconductor device having a copper element and method of forming a semiconductor device having a copper element	Electricity	0	Active
US7169716B2	Photosensitive lacquer for providing a coating on a semiconductor substrate or a mask	Physics	0	Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.