Integral dam and heat sink for semiconductor device assembly
US5227663A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1992 |
| Grant date | Jul 13, 1993 |
| Priority date | — |
| Expiry date | Mar 18, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metallic or ceramic dam structure surrounding a semiconductor die in a semiconductor device assembly is disclosed. The dam structure forms a cavity containing a potting compound encapsulating the die. The dam structure may also be provided with a flat lid portion, enclosing the cavity and forming a flat, exterior, heat-dissipating surface for the semiconductor device assembly. Further, an additional add-on structure, having heat dissipating fins, may be joined to the dam structure, exterior the semiconductor device assembly, to provide additional heat dissipation. The add-on structure is particularly well-suited to applications where air cooling is available.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.