Patent · US Expired

High density semiconductor memory module using split finger lead frame

US5227995A · kind A · utility

22Cited by

20References

7Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Erich Klink · Schenefeld, DE
Helmut Kohler · Mülheim, DE
Harald Pross · Wildberg, DE

Key dates

Filing date	Jul 17, 1990
Grant date	Jul 13, 1993
Priority date	—
Expiry date	Jul 17, 2010

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The semiconductor memory module comprises a housing of plastic or ceramic in which two chips are stacked together back-to-back. The pads of the chips are electrically connected by wire bonding to beam leads which comprise outer bond leads, generally arranged outside the housing to form the contact pins or contact leads of the module to a printed circuit board, and inner bond leads in the housing. The inner bond leads are split and spread in the area of the inner lead bond ends into upper and lower sets forming a gap for receiving and holding the stacked chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.