Laser machining apparatus and method of the same
US5229569A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 1991 |
| Grant date | Jul 20, 1993 |
| Priority date | — |
| Expiry date | May 30, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/032
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser machining apparatus includes a laser beam source, such as of excimer laser, which produces a laser beam to be projected on a work piece or a sample, first and second illumination light sources which have wavelengths substantially equal to the wavelength of the laser beam and illuminate the entire image and the laser beam, respectively, a first beam splitter which guides the image produced by the illumination light to an observation unit, a second beam splitter which guides the laser beam from the laser beam source to an objective lens, and a controller which controls the machining condition including the relative positioning between the sample and the laser beam depending on the result of observation. The laser beam guide path structure from the laser beam source to the sample has its interior wall made of laser-transparent material such as glass, and the transparent material is enclosed by a laser blocking material such as a metal or water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.