Kaoru Katayama
26Patents
9h-index
43Co-inventors
75Inventor score
Filing activity: Jan 23, 1985 → May 14, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5832595A | Method of modifying conductive lines of an electronic circuit board and its apparatus | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5499668A | Process for making electronic device | Electricity | 26 | Expired |
| US5801350A | Surface reformation method of high polymer material | Emerging Cross-Sectional Technologies | 25 | Expired |
| US7329855B2 | Optical inspection of glass bottles using multiple cameras | Physics | 19 | Expired |
| US6435401B1 | Apparatus and a method for removing solder from an object | Electricity | 16 | Expired |
| US4573808A | Pneumatic journal bearing | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5229569A | Laser machining apparatus and method of the same | Performing Operations; Transporting | 13 | Expired |
| US5262614A | Circuit board and sealing structure and methods for manufacturing the same | Electricity | 11 | Expired |
| US5940728A | Process for manufacturing electronic circuits | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6457228B1 | Method for sealing liquid coolant into module | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7330251B2 | Method and apparatus for producing reference image in glass bottle inspecting apparatus | Physics | 8 | Expired |
| US8284350B2 | Lighting system and liquid crystal display using the same | Electricity | 7 | Active |
| US6281575A | Multi-chip module | Electricity | 6 | Expired |
| US6161748A | Process for manufacturing electronic circuits | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6269998A | Process for manufacturing electronic circuits | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6133135A | Process for manufacturing electronic circuits | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5023407A | Printed circuit board with a uniform conductive layer formed by equalization of metals therein | Electricity | 3 | Expired |
| US6739045B2 | Method for removing solder bumps from LSI | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6325270A | Solder removing apparatus | Performing Operations; Transporting | 2 | Expired |
| US6423405B1 | Surface reformation method of high polymer material | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6433810B1 | Laser printing method and apparatus for printing characters | Electricity | 1 | Expired |
| US6017424A | Laser assisted surface reformation method of high polymer material | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6795105B2 | Laser printing method and apparatus | Electricity | 0 | Expired |
| US6410881B1 | Process for manufacturing electronic circuits | Emerging Cross-Sectional Technologies | 0 | Expired |
| US7401393B2 | Method for removing solder bumps from LSI | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.