Patent · US Expired

Method of soldering together two components

US5234865A · kind A · utility

8Cited by
9References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 26, 1992
Grant dateAug 10, 1993
Priority date
Expiry dateFeb 26, 2012

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/10253
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method for soldering together a first, in particular electrical, component with a second, in particular electrical, component, where a solder preform is disposed between the components and is fixed by pressing it against edges of at least one depression in one of the components to prevent lateral dislocation and where subsequently the soldering process takes place, preferably in a soldering furnace. A special feature is that the depression is formed as grooves (10) extending in a closed loop (11), in particular in the shape of a circle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.