Method of soldering together two components
US5234865A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1992 |
| Grant date | Aug 10, 1993 |
| Priority date | — |
| Expiry date | Feb 26, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for soldering together a first, in particular electrical, component with a second, in particular electrical, component, where a solder preform is disposed between the components and is fixed by pressing it against edges of at least one depression in one of the components to prevent lateral dislocation and where subsequently the soldering process takes place, preferably in a soldering furnace. A special feature is that the depression is formed as grooves (10) extending in a closed loop (11), in particular in the shape of a circle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.