Connections between circuit chips and a temporary carrier for use in burn-in tests
US5237269A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1991 |
| Grant date | Aug 17, 1993 |
| Priority date | — |
| Expiry date | Mar 27, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for conducting burn-in tests of circuit chips in which frangible connections are made between contact points of a reusable carrier and a chip to be tested. At the end of the burn-in test, shear force is imparted such that the frangible connections are broken without causing damage to the chip or the carrier. The carrier has at least one lead line or pad made of solder wettable material such as copper for making electrical connections with solder balls of the chip. The lead line is covered with an overlay which is made of non-wettable material to which solder will not adhere. Holes are provided in the overlay such that a restricted connection may be made between the solder balls and the underlaying lead line when the solder is reflowed. At the end of the test, linear shear force is imparted such that the connections between the solder balls and the lead line are broken. The solder balls are then reflowed to reshape them for subsequent use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.