Photoresist composition containing block copolymer resin and positive-working o-quinone diazide or negative-working azide sensitizer compound
US5238776A · kind A · utility
13Cited by
7References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 27, 1991 |
| Grant date | Aug 24, 1993 |
| Priority date | — |
| Expiry date | Feb 27, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0226
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photoresist comprising a light sensitive component and an alternating copolymer resin formed by condensing a preformed bishydroxymethylated compound and a reactive phenol, in the absence of an aldehyde. Additional useful resins may be formed by further reacting the alternating copolymer with a second reactive phenol in the presence of an aldehyde to form substantially block copolymers. The use of these resins in photoresist formulations leads to improved thermal properties, etch resistance and photospeed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.