Photosensitive resin composition with polyamic acid polymer
US5238784A · kind A · utility
17Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 1990 |
| Grant date | Aug 24, 1993 |
| Priority date | — |
| Expiry date | Nov 28, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S522/906
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a photosensitive resin composition which comprises, as essential components: PA0 (A) a polyamic acid having a recurring unit represented by the following formula [I]: ##STR1## wherein R.sub.1 and R.sub.2 each represents an organic group selected from the group consisting of an aromatic group, an alicyclic group, an aliphatic group, and a heterocyclic group and m is 1 or 2, PA0 (B) an amide compound having carbon-carbon double bond, and PA0 (C) a photosensitizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.