Akira Tokoh
4Patents
4h-index
6Co-inventors
36Inventor score
Filing activity: Nov 28, 1990 → Mar 18, 1994
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5449584A | Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5206337A | Solvent-soluble polyimidesiloxane oligomer and process for producing the same | Chemistry; Metallurgy | 30 | Expired |
| US5238784A | Photosensitive resin composition with polyamic acid polymer | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5385808A | Photosensitive resin composition and semiconductor apparatus using it | Chemistry; Metallurgy | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.