Fluid flow control method and apparatus for minimizing particle contamination
US5240046A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1992 |
| Grant date | Aug 31, 1993 |
| Priority date | — |
| Expiry date | Jul 15, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0396
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A fluid flow control for use with a process chamber. In the disclosed embodiment, the process chamber is for ion implantation of a workpiece and the fluid flow control is to assure the flow rates are maintained at values which are efficient in evacuating and pressurizing the chamber but are not high enough to dislodge particulate contaminants from the process chamber walls. In the disclosed design, the invention has utility both in instances in which wafers are directly inserted into the process chamber for ion implantation and in which the wafers are inserted into the chamber by use of a load-lock which avoids the requirement that the process chamber be cyclicly pressurized and depressurized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.