Semiconductor wafer stacking apparatus and method
US5240557A · kind A · utility
11Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1992 |
| Grant date | Aug 31, 1993 |
| Priority date | — |
| Expiry date | Jun 1, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus stacks semiconductor wafers and spacers and clamps them in an axial alignment for mounting in a semiconductor wafer edge polishing machine. After edge polishing, the apparatus separates the wafers and spacers and delivers them respectively into separate cassettes for further processing or recycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.