Direct distribution repair and engineering change system

US5243140A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Harsaran S. Bhatia · Beacon, US
• Mario J. Interrante · New Paltz, US
• Suresh D. Kadakia · Hopewell Junction, US
• Shashi D. Malaviya · Hopewell Junction, US
• Mark H. McLeod · Poughkeepsie, US
• Sudipta K. Ray · Wappingers Falls, US
• Herbert I. Stoller · Wappingers Falls, US

Key dates

• Filing date: Oct 4, 1991
• Grant date: Sep 7, 1993
• Expiry date: Oct 4, 2011

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A direct distribution wiring system is provided which facilitates the effecting of repair or engineering change in a Multi-chip module (MCM) while eliminating the need for redistribution and/or buried connections between IC attachment pads and engineering change pads, thus eliminating the need for patterned conductor layers corresponding to such functions. The operation of the MCM is improved by the wiring system allowing the reduction of lumped capacitances by disconnection of defective conductors, accomplished by providing severable connectors in a direct distribution structure, as well as the elimination of redistribution wiring layers and increased IC density on the MCM. Full potential fault coverage as well as full discretion in reversible engineering changes is provided by forming all elements of the wiring system on the surface of the device.