Mario J. Interrante
47Patents
17h-index
80Co-inventors
84Inventor score
Filing activity: Dec 17, 1981 → May 31, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5990418A | Hermetic CBGA/CCGA structure with thermal paste cooling | Electricity | 94 | Expired |
| US6740959B2 | EMI shielding for semiconductor chip carriers | Electricity | 65 | Expired |
| US6235996A | Interconnection structure and process module assembly and rework | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5193732A | Apparatus and methods for making simultaneous electrical connections | Electricity | 35 | Expired |
| US6283359A | Method for enhancing fatigue life of ball grid arrays | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6158644A | Method for enhancing fatigue life of ball grid arrays | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6287126A | Mechanical attachment means used as electrical connection | Electricity | 27 | Expired |
| US6458623B1 | Conductive adhesive interconnection with insulating polymer carrier | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5243140A | Direct distribution repair and engineering change system | Electricity | 25 | Expired |
| US6429388B1 | High density column grid array connections and method thereof | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5153408A | Method and structure for repairing electrical lines | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5288007A | Apparatus and methods for making simultaneous electrical connections | Electricity | 22 | Expired |
| US6892925B2 | Solder hierarchy for lead free solder joint | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6518674B2 | Temporary attach article and method for temporary attach of devices to a substrate | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5425493A | Selective addition of a solder ball to an array of solder balls | Electricity | 18 | Expired |
| US6532654B2 | Method of forming an electrical connector | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6216937A | Process and apparatus to remove closely spaced chips on a multi-chip module | Electricity | 17 | Expired |
| US4634638A | High melting point copper-gold-tin brazing alloy for chip carriers | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6259155A | Polymer enhanced column grid array | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5945735A | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | Electricity | 14 | Expired |
| US5543584A | Structure for repairing electrical lines | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6762119B2 | Method of preventing solder wetting in an optical device using diffusion of Cr | Electricity | 12 | Expired |
| US5478009A | Selective removal of a single solder ball from an array of solder balls | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6574859B2 | Interconnection process for module assembly and rework | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6037193A | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | Electricity | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.