Semiconductor element-mounting printed board
US5248853A · kind A · utility
29Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1991 |
| Grant date | Sep 28, 1993 |
| Priority date | — |
| Expiry date | Nov 14, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor element-mounting printed board, comprising a substrate having a thermal expansion coefficient not higher than 4.5.times.10.sup.-6 /.degree. C., a buffer layer formed on at least one of the surfaces of the substrate and having a Young's modulus not higher than 450 kg/mm.sup.2, a conductor circuit formed on a surface of the buffer layer, the conductor circuit having predetermined patterns, and a semiconductor element bonded to the conductor circuit by soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.