Method of bonding semiconductor chips to a substrate
US5249732A · kind A · utility
31Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 9, 1993 |
| Grant date | Oct 5, 1993 |
| Priority date | — |
| Expiry date | Feb 9, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of bonding a pad on a semiconductor chip to a corresponding pad on a carrier, a wire ball is attached to the pad on the chip by bonding one end of a low melting temperature aluminum alloy bond wire to the chip pad. The wire is then broken off at the bond. A bead is formed on the chip pad by heating the ball to a temperature slightly above the melting point of the bond wire material for a predetermined period of time. The melted bead is then placed into contact with a corresponding pad on the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.